贝格斯公司的CPU Pad是一种导热绝缘的双面胶带。它是由高性能的丙烯酸压敏粘合剂涂覆在薄膜表面制成。CPU Pad普遍用于带芯片的场合。典型应用是将散热片固定在线路板上的CPU上 CPU Pad 的使用方法 CPU Pad是一种高性能的压敏胶带，只需施加很小甚至不需施加应力即可产生很强的粘接力。部件可以很简单地放在CPU Pad上。部件放好后立即牢固地粘接在一起，不再需要夹具力或较高的压力。 同时提供多种型号的导热材料：sil-pad 400，sil-pad 800,sil-pad 900s,sil-pad 980,sil-pad 1100ST,sil-pad 1200,sil-pad A1500ST,sil-pad 2000,sil-pad A2000,sil-pad K-4,sil-pad K-6,sil-pad K-10,Q-Pad 2,Q-Pad 3,oly-Pad1000, 400,Poly-Pad1000,Poly-Pad K-4,Poly-Pad K10，Gap Pad VO, Gap Pad VO soft, Gap Pad Ultra Soft, Gap Pad VO Ultimate, Gap Pad 1000SF, Gap Pad HC1000, Gap Pad 1500, Gap Pad 1500R, Gap Pad 1500S30, Gap Pad a2000, Gap Pad 2000S40, Gap Pad 2200SF, Gap Pad 2500S20, Gap Pad 2500, Gap Pad A3000, Gap Pad 3000S30, Gap Pad 5000S35, Gap Filler 1000(Two-Part), Gap Filler 1100SF(Two-Part), Gap Filler 1500(Two-Part), Gap Filler 2000(Two-Part), Gap Filler 3500S35(Two-Part),TIC 1000A,TIC 4000,Hi-Flow 105, Hi-Flow 225F-AC, Hi-Flow 225UT, Hi-Flow 225U, Hi-Flow 625, Hi-Flow 300P, Hi-Flow 300G, Hi-Flow 565U, Hi-Flow 565UT, Hi-Flow 650P,Bond-Ply 100, Bond-Ply 400, Bond-Ply 660P, Liqui-Bond SA 1000(One-Part), Liqui-Bond SA 1800(One-Part), Liqui-Bond SA 2000(One-Part)