Gap Pad V0 Soft推荐用于低应力用途，包括用做界面和一面接触焊接装置的用途。 Gap Pad V0 Soft 是一种导热材料，用做散热片和电子设备的传热界面。Gap-PadV0 Soft的形状适应性使其能填满PC板和散热片或金属底架的空气间隙。 Gap Pad V0 Soft是由形状适应性良好的低模量聚合物附在玻纤基材上制成。该材料的厚度从0.020英寸到0.160英寸并在材料的一面有保护膜。Gap Pad V0 Soft 的厚度和柔软性使其可以用在许多表面纹理多变及表面之间空间不均匀的用途。该材料有带胶和不带胶两种形式供货。标准面积是8英寸X16英寸. 同时提供多种型号的导热材料：sil-pad 400，sil-pad 800,sil-pad 900s,sil-pad 980,sil-pad 1100ST,sil-pad 1200,sil-pad A1500ST,sil-pad 2000,sil-pad A2000,sil-pad K-4,sil-pad K-6,sil-pad K-10,Q-Pad 2,Q-Pad 3,oly-Pad1000, 400,Poly-Pad1000,Poly-Pad K-4,Poly-Pad K10，Gap Pad VO, Gap Pad VO soft, Gap Pad Ultra Soft, Gap Pad VO Ultimate, Gap Pad 1000SF, Gap Pad HC1000, Gap Pad 1500, Gap Pad 1500R, Gap Pad 1500S30, Gap Pad a2000, Gap Pad 2000S40, Gap Pad 2200SF, Gap Pad 2500S20, Gap Pad 2500, Gap Pad A3000, Gap Pad 3000S30, Gap Pad 5000S35, Gap Filler 1000(Two-Part), Gap Filler 1100SF(Two-Part), Gap Filler 1500(Two-Part), Gap Filler 2000(Two-Part), Gap Filler 3500S35(Two-Part),TIC 1000A,TIC 4000,Hi-Flow 105, Hi-Flow 225F-AC, Hi-Flow 225UT, Hi-Flow 225U, Hi-Flow 625, Hi-Flow 300P, Hi-Flow 300G, Hi-Flow 565U, Hi-Flow 565UT, Hi-Flow 650P,Bond-Ply 100, Bond-Ply 400, Bond-Ply 660P, Liqui-Bond SA 1000(One-Part), Liqui-Bond SA 1800(One-Part), Liqui-Bond SA 2000(One-Part)